Here's another view of the connector end with some slight revisions of the ground fill and keepout boundaries between the ESD and connector components.
Summary:
1. I moved the East extent of the layer 3 ground fill east to the edge of the connector pads. 2. The layer 2 ground keepout remains open under the high-frequency pads of both the ESD component and the connector. 3. The layer 2,3,4 ground keepout West edge moved with the East edge of the layer 3 ground fill to the edge of the connector pads.
Thanks for the images and video, Luke.
Basically, this change is an attempt to drop from layer 1 microstrips over layer 2 ground in the normal transmission line to layer 1 microstrips over layer 3 ground as we pass through the ESD component layout and on to the connector at which point we transition to layer 1 pads (close spacing) over layer 5 ground.
On the other side we have layer 6 microstrips over layer 5 ground in the normal transmission line. We transition to layer 6 microstrips over layer 4 ground as we pass through the ESD component layout. We move back to layer 6 microstrips over layer 5 ground on the way to the vias that will connect us to layer 1 connector pads.
