On Sun, Dec 24, 2017 at 10:29 PM, Richard Wilbur richard.wilbur@gmail.com wrote:
Thanks again for the pictures and the video.
no problem
Concerning the keepouts under the connector:
- At the north boundary I would pull the edge up a little further north away from the northwestern differential pair.
oh! ha, i just made it the opposite direction :) reason: HHPD acts (kinda) as a GND for that top (HTX2P) and when i did the flood-fill it looked really weird. i'm switching to a couple of different viewing styles (one of them is actually the gerbers, there's an "X-Ray" option.
the top 2 VIAs right next to HTX2P are too far away, and the 15mil-to-GND-keepout condition makes things unbalanced. see proposed GREEN new via placements and YELLOW track to correct that.
when i show X-ray-mode gerbers layers 1 & 2 i mark in yellow at top a proposed modification, look good? you can see to pin 4 there is that GND via, the shape of the hole gets really weird / sharp edges there.
also i'm aware that the layer 2 and 5 bottom-most curved-shaped-keepout-holes are about 1 mil too far to the left, see yellow (SE corner) where i'll move them both over.
- At the west boundary I see your point regarding layers 4 and 5.
Looks like you have made a good solution. I suppose you could add 5mil additional overlap. How much overlap does it currently have?
currently arouuund 9mil roughly.
How much opening from the edge of the keepout on layer 4 to the edge of the closest connector pads?
around 4mil. tracks are 5mil so can use that as a scale.
I would vote to keep the layer 5 holes under the layer 6 ESD pads for the same reason we added them to layer 2 for the ESD pads on layer 1.
yehyeh.
Some of the adjustments on layer 6 might be taken care of by modifying the net groups to create an "HDMI High-Frequency" group which contains only the differential pairs {HTX2P, HTX2N, HTX1P, HTX1N, HTX0P, HTX0N, HTXCP, HTXCN}, apply the 15mil conditional clearance rule to that group.
that's what's already done :)
oh, except to VIAs i kept it at 5mil, now i remember. 15 mil to landing pads, 15 mil to tracks, 5mil to VIAs i think this was because i didn't want the holes made by VIAs to be too large. what you think? make them 15mil too?
l.
