--- crowd-funded eco-conscious hardware: https://www.crowdsupply.com/eoma68
On Thu, Aug 3, 2017 at 11:53 PM, Richard Wilbur richard.wilbur@gmail.com wrote:
We can still take some of the recommendations to heart:
- Use minimal size vias for high-frequency traces to reduce
parasitic capacitance.[23]
yep. 0402 all the way round. can't go smaller as it risks the drill hitting the edge of the ring.
- Place the two vias of the differential pair in close proximity to
increase capacitive coupling between the signals.(smaller via pitch)
yep. doing that.
- Instead of using two separate anti-pads on signal vias, combine
them into an oval shared antipad (on every layer) to reduce parasitic capacitance.
oo. never heard of this practice. never heard of "anti-pads" either! so sorry, if you put some references i missed them.
- Place ground vias next to signal vias to provide low-impedance
ground-return paths.[22, Figure 2]
yep doing that.
l.