--- crowd-funded eco-conscious hardware: https://www.crowdsupply.com/eoma68
On Fri, Dec 22, 2017 at 10:32 PM, Richard Wilbur richard.wilbur@gmail.com wrote:
Here's another view of the connector end with some slight revisions of the ground fill and keepout boundaries between the ESD and connector components.
Summary:
- I moved the East extent of the layer 3 ground fill east to the
edge of the connector pads.
ok remember that ground flood-fill is the entire layer 3, i'm not creating a *specific* area for ground "fill", it's done by default according to the (specified) design rules. with the new "conditional" rule added, layer 3 now looks like this: http://hands.com/~lkcl/eoma/a20/275_hdmi/layer3.jpg
so there's a few things i need to sort out, which i'll get to: main reason for showing that image is: the clearance to the VIAs has also extended to 15mil now. i believe it's not so much the vias though as the tracks connected *to* the vias. if there has to be a 5 mil clearance to those i can... maybe sort something out :)
- The layer 2 ground keepout remains open under the high-frequency
pads of both the ESD component and the connector.
ok cool.
- The layer 2,3,4 ground keepout West edge moved with the East edge
of the layer 3 ground fill to the edge of the connector pads.
oh wait... i haven't put in a keepout *at all* on layers 3 and 4. you think it would be best to punch the hole *right* down so that it's only layer 5 providing a GND plane for both sides? it makes sense, i just want to confirm.
Thanks for the images and video, Luke.
ehn the vides are fun :)
l.