* the PCB will fall out of the casework (both ways, forwards and backwards).
* it will also lift upwards by about... 1mm, rattling around.
* the middle layers also need to be split into separate halves.
right now, the components are in the way.
* the layer below the PCB (with a cutout for the micro-sd card) will
be in direct contact with the PCB, preventing heat dissipation
* also you notice the cut-away in the corner of the PCB underneath
the eject button for the PCMCIA holder? the idea there is to put a
small recess (which we have to think how not to interfere with the
aesthetics) that will make it easier to eject.