On Wed, Jan 3, 2018 at 9:53 PM, Luke Kenneth Casson Leighton lkcl@lkcl.net wrote:
On Thu, Jan 4, 2018 at 12:22 AM, Richard Wilbur richard.wilbur@gmail.com wrote:
My initial feedback is it looks pretty nice. I sat down, read the documentation for the gerber viewer that comes with KiCAD and started getting my feet wet.
good god. you read documentation?? :)
I scanned it fairly quickly to get a good idea of how to interact with the program. That way I had some idea what the icons meant and what functions were available in the user interface. (Okay, I've written documentation before so I figured since it was available I'd look it over. It gave me a pretty quick idea of how the user interactions are structured.)
One recommendation for now as I have to leave for choir rehearsal--do the same thing with additional ground traces north and south of the ESD pads on layer 6 as you did on layer 1 to bring the distance between pad and ground down from 15mil to around the same as the pad-to-pad spacing of the ESD component pads.
yep sorted. will send you new gerber set, for anyone else to see (and also make it easier for you, richard) attached screenshot.
Beautiful!
I think that was the most important change I noticed. I am mainly looking at the HDMI which we have been laboring over the last few months.
My next suggestion has an associated question:
I notice that north of the long east-west transmission line, at the northern keepout boundary on layer 6, there are a couple of vias that have almost complete ground shield between the vias and the HDMI TX2 pair.
Question: What is the fill polygon width for ground fill on layer 6?
I can see two fairly simple solutions to complete the ground shield around these vias: 1. Add traces to complete the ground shield between vias and HDMI differential pair. 2. Adjust trace/fill polygon width for ground fill on layer 6 till the ground shield is complete.
I'll sleep on it and take another look tomorrow morning.