On Mar 27, 2019, at 06:21, Luke Kenneth Casson Leighton lkcl@lkcl.net wrote:
On Tue, Mar 26, 2019 at 11:52 PM David Niklas doark@mail.com wrote:
On Sat, 23 Mar 2019 16:56:25 +0000 Luke Kenneth Casson Leighton lkcl@lkcl.net wrote:
<snip> > > not a snowball in hell's chance. resin is too brittle, 3D printing > is far too inaccurate, and the plastic is extremely thin. 5 years ago > the ones we had stamped out for prototypes (laser-cutting i believe) > broke almost immediately. >
What material did you laser cut? I would have thought that laser cut aluminum would be perfect.
ten prototypes of the mass-produced PCMCIA plastic surround from Litkconn had holes laser-cut to make space for the micro-sd, micro-hdmi and USB-OTG ports.
the result was plastic under 1mm deep that had only around 0.5mm height below e.g. the micro-sd card and it of course snapped immediately.
Sounds like a more flexible plastic is needed but that clearly impacts the manufacturing processes available and thus the cost.
as a result we considered very thin metal sheet (thick foil in effect) that could be stamped (or laser cut) and was effectively a "metal sticker" that could go over the end and be bent round. probably even by hand.
Did you try the foil? How well did it work?