On Fri, Dec 5, 2014 at 4:15 PM, Luke Kenneth Casson Leighton lkcl@lkcl.net wrote:
On Fri, Dec 5, 2014 at 3:30 PM, joem joem@martindale-electric.co.uk wrote:
On Thu, 2014-12-04 at 23:45 +0000, Luke Kenneth Casson Leighton wrote:
started on a first revision of the tablet casework, as a pyopenscad program, using a blender-exported STL as the "ghost" template to work out how the case should surround the parts. it's done as layers so may either be made of wooden laminates or 3D printed and assembled using screws/bolts.
I got limited wood veneer about 1mm thick to make own laminate cut with laser. Let me know where to download the dxf file (or whatever), to try make something.
http://hands.com/~lkcl/3dcase.tgz - do you know how to take dxf slices from openscad?
http://hands.com/~lkcl/3dcase.tgz
worked it out. there's a function "projection" - the resultant output needs to be opened in openscad then manually exported, it takes forever but i ran it the 5 times needed and produced 5 DXF files. assuming 1mm veneer:
layer 1: qty 2 needed (touchpanel surround) layer 2: qty 2 needed (lcd and pcb inset) layer 3: qty 3 needed (component surround, microsd) layer 4: qty 4 needed (component surround) layer 5: qty 1 needed (lid)
so those are 2.0mm, 2.0mm, 3.0mm, 4.0mm and 1.0mm
the files may actually contain more than one part (as there are gaps) so they may need editing. also i noticed i got the holes just above the micro-sd... also i realised i need to modify this to take into account the capacitive panel cable *sigh* but it took so damn long to run i'd be happy to modify the layer by hand.
let me know, joe, if the dxf files are good for the machine you're using.
l.